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PHYSICAL VAPOR DEPOSITION (PVD) PROCESS IS USED IN LED CHIP MANUFACTURING,SIC PVD TRAY

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PHYSICAL VAPOR DEPOSITION (PVD) PROCESS IS USED IN LED CHIP MANUFACTURING,SIC PVD TRAY

Brand Name : ZG

Model Number : MS

Certification : CE

Place of Origin : CHINA

MOQ : 1 piece

Price : USD10/piece

Payment Terms : L/C, D/A, D/P, T/T, Western Union, MoneyGram

Supply Ability : 10000 pieces per month

Delivery Time : 3 working days

Packaging Details : Strong wooden box for Global shipping

Application : fine chemical industry, pharmaceutical industry, environmental protection engineering

Dimension : the maximum diameter of tube bundle block can reach 200mm, and the height can be 500mm.

Material : Silicon carbide

Color : Black

Product name : silicon carbide tube bundle block

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SiC PVD Tray

Silicon carbide PVD tray is formed by isostatic pressing process and sintering at high temperature. The outer diameter, thickness, number and size of acupoints, position and shape of the tablet groove can also be finished according to the requirements of the user's design drawings to meet the specific requirements of the user.

Typical applications
  • Physical Vapor Deposition (PVD) process is used in LED chip manufacturing.
Features and advantages
  • High density
  • Good thermal conductivity, low coefficient of expansion and temperature uniformity
  • Plasma impact resistance
  • Resistant to all kinds of strong acid and alkali chemical reagent corrosion
  • After semiconductor grade cleaning
Specifications 230/300/330mm
PHYSICAL VAPOR DEPOSITION (PVD) PROCESS IS USED IN LED CHIP MANUFACTURING,SIC PVD TRAY

Product Tags:

330mm Silicon Carbide PVD Tray

      

300mm Silicon Carbide PVD Tray

      

330mm SiC PVD Tray

      
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